WebSep 1, 2024 · Inductively coupled plasma (Oxford ICP 180) in a mixture of Cl 2 [45 standard cubic centimeter per minute (sccm)] and O 2 (4 sccm) with an radio frequency (RF) power of 10 W is used to .
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WebSpecifications Inductively coupled plasma (ICP) power source: up to 2500 W at 2.4 MHz. Radio frequency (RF) power source: up to 600 W at 13.56 MHz. Electrode temperature range: -150 °C to 300 °C. Unique process gases: octafluorocyclobutane (C 4 F 8 ), trifluormethane (CHF 3 ), and Sulfur Exafluoride (SF6). WebWashington Oxford 100 ICP-180 Cl2, BCl3, SF6, silicon 100mm 300C CH4, H2, N2, O2, Ar III-V's, Ti, Al Washington Oxford 100 ICP-180 SF6, C4F8, CHF3, N2O silicon 100mm cryo-chuck SiH4, N2, Ar, O2 silicon based SiO2-PECVD dielectrics, Nb, W, Ti metals, polymers. NNCI Dry Etch Capabilities passage for class 9th
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WebThis ICPCVD process module is designed to produce high quality films at low growth temperatures, enabled through high-density remote plasmas that achieves superior film … ICP RIE Etch PlasmaPro 80 ICP PlasmaPro 100 Cobra ICP PlasmaPro 100 Polaris … Oxford Instruments is committed to providing a comprehensive, flexible and … Titanium Dioxide (TiO2) has a refractive index of 2.488, 2.583 or 2.609 for the … Silicon Dioxide (SiO 2) in its variety of forms is an essential material for … WebOxford Instruments ICP 180. Plasma assisted etching of III-V semiconductor materials; Samples form 6x6mm on 4” Si-carrier up to 4“ wafer; Base pressure 6x10-7 Torr; Temperature controlled Stage –150°C to 400°C; CH 4, H 2, Cl 2, CF 4, SF 6, O 2, Ar, and N 2 SiCl4 available after special introduction by responsibles; RF 13.56 MHz 500W source WebOur Oxford ICP-RIE Plaslab 180 utilizes a 3kW RF power supply to generate a remote plasma of Cl2, BCl3, H2, Ar, NF3, O2, SF6, and/or C4F8 gas species that can be further accelerated (300W table bias) toward a substrate resulting in a combination of physical and chemical dry etching for material removal. tinkers construct longbow build